Advanced Interconnects for ULSI Technology

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Edition: 1
Publisher: Wiley
Binding: Hardcover
ISBN: 0470662549
Category: Programming
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Advanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. Programming books Advanced Interconnects for ULSI Technology pdf. . Download books Advanced Interconnects For Ulsi Technology By Mikhail Baklanov Hardcover Boo pdf via mediafire, 4shared, rapidshare.

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Advanced Interconnects for ULSI Technology by Baklanov, Mikhail R./ Ho, Paul S./ Zschech, Ehrenfried [Hardcover]

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Store Search search Title, ISBN and Author Advanced Interconnects for ULSI Technology by Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech Estimated delivery 3-12 business days Format Hardcover Condition Brand New Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Publ

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format hardback language english publication year 02 03 2012 subject engineering technology subject 2 electronics engineering communications engineering title advanced interconnects for ulsi technology author baklanov mikhail ho paul s zschech ehrenfried publisher john wiley sons inc publication date mar 20 2012 pages 606 binding hardcover edition 1 st dimensions 6 85 wx 9 92 hx 1 26 d isbn 0470662549 subject technology engineering electronics circuits vlsi ulsi description this book presents

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While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical  properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Download free Advanced Interconnects for ULSI Technology pdf